april 2008 rev 6 1/10 10 STPS2L30 low drop power schottky rectifier features low cost device with low drop forward voltage for less power dissipation optimized conduction/reverse losses trade-off which lead to the highest yield in the applications surface mount miniature packages avalanche capability specified description single schottky rectifier suited to switched mode power supplies and high frequency dc to dc converters, freewheel diode and integrated circuit latch up protection. packaged in sma and low profile sma and smb, this device is especially intended for use in parallel with mosfets in synchronous rectification. table 1. device summary i f(av) 2 a v rrm 30 v t j (max) 150 c v f (max) 0.375 v k a k a k a sma STPS2L30a smb flat STPS2L30uf sma flat STPS2L30af www.st.com
characteristics STPS2L30 2/10 1 characteristics to evaluate the conduction losses use the following equation: p = 0.24 x i f(av) + 0.068 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 30 v i f(av) average forward current sma flat t l = 130 c = 0.5 2a sma t l = 120 c = 0.5 smb flat t l = 135 c = 0.5 i fsm surge non repetitive forward current t p =10 ms sinusoidal 75 a p arm repetitive peak avalanche power t p = 1 s tj = 25 c 1500 w t stg storage temperature range -65 to + 150 c t j operating junction temperature (1) 150 c 1. condition to avoid thermal runaway for a diode on its own heatsink dptot dtj --------------- 1 rth j a ? () ------------------------- - < table 3. thermal resistance symbol parameter value unit r th(j-l) junction to lead sma flat 20 c/w sma 30 smb flat 15 table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 200 a t j = 100 c 6 15 ma v f (1) forward voltage drop t j = 25 c i f = 2 a 0.45 v t j = 125 c 0.325 0.375 t j = 25 c i f = 4 a 0.53 t j = 125 c 0.43 0.51 1. pulse test: t p = 380 s, < 2%
STPS2L30 characteristics 3/10 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) sma 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 p (w) f(av) t =tp/t tp i (a) f(av) = 1 = 0.05 = 0.1 = 0.2 = 0.5 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 150 i (a) f(av) t (c) amb r =120c/w th(j-a) r=r th(j-a) th(j-l) sma t =tp/t tp figure 3. average forward current versus ambient temperature ( = 0.5) smb flat figure 4. average forward current versus ambient temperature ( = 0.5) sma flat 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 150 i (a) f(av) t (c) amb r=r th(j-a) th(j-l) t =tp/t tp smb flat r =120c/w th(j-a) i (a) f(av) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 150 r th(j-a) =r th(j-l) t =tp/t tp r th(j-a) =200 c/w sma-flat t (c) amb figure 5. non repetitive surge peak forward current versus overload duration (maximum values) sma figure 6. non repetitive surge peak forward current versus overload duration (maximum values) smb flat 0 1 2 3 4 5 6 7 8 9 10 1.e-03 1.e-02 1.e-01 1.e+00 i m t =0.5 i (a) m t(s) t =25c a t =75c a t =125c a sma 0 5 10 15 20 25 30 1.e-03 1.e-02 1.e-01 1.e+00 i (a) m t =25c l t =75c l t =125c l smb flat (non exposed pad) i m t =0.5 t(s)
characteristics STPS2L30 4/10 figure 7. non repetitive surge peak forward current versus overload duration (maximum values) sma flat figure 8. normalized avalanche power derating versus pulse duration i (a) m 0 1 2 3 4 5 6 7 8 1.e-03 1.e-02 1.e-01 1.e+00 t a =25 c t a =75 c t a =125 c i m t =0.5 sma-flat t(s) 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm figure 9. normalized avalanche power derating versus junction temperature figure 10. relative variation of thermal impedance, junction to ambient, versus pulse duration - sma 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t) p (25c) arm j arm 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z/r th(j-a) th(j-a) t =tp/t tp t (s) p single pulse sma figure 11. relative variation of thermal impedance junction to lead versus pulse duration - smb flat figure 12. relative variation of thermal impedance junction to ambient versus pulse duration - sma flat 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 z/r th(j-l) th(j-l) smb flat t (s) p single pulse z/r th(j-a) th(j-a) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 single pulse sma-flat t (s) p
STPS2L30 characteristics 5/10 figure 13. reverse leakage current versus reverse voltage applied (typical values) figure 14. junction capacitance versus reverse voltage applied (typical values) 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 5 10 15 20 25 30 i (ma) r v (v) r t =125c j t =150c j t =100c j t =25c j 10 100 1000 1 10 100 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j figure 15. forward voltage drop versus forward current (high level) figure 16. forward voltage drop versus forward current ( low level) i (a) fm 0.1 1.0 10.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 t j =25 c (maximum values) t j =125 c (maximum values) t j =125 c (maximum values) t j =125 c (typical values) v (v) fm i (a) fm 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 t j =25 c (maximum values) t j =125 c (maximum values) t j =125 c (maximum values) t j =125 c (typical values) v (v) fm figure 17. thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board fr4, copper thickness = 35 m) (sma, smb flat) figure 18. thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board fr4, copper thickness = 35 m) (sma flat) 0 10 20 30 40 50 60 70 80 90 100 110 120 130 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 r (c/w) th(j-a) s (cm2) cu smb flat) sma r (c/w) th(j-a) 0 20 40 60 80 100 120 140 160 180 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 sma-flat s (cm2) cu
package information STPS2L30 6/10 2 package information epoxy meets ul94, v0 in order to meet environmental requirements, st offers these devices in ecopack ? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at www.st.com . figure 19. sma footprint (dimensions in mm) table 5. sma dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.094 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.90 0.089 0.114 e 4.80 5.35 0.189 0.211 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b 2.63 5.43 1.4 1.64 1.4
STPS2L30 package information 7/10 figure 20. sma flat (non exposed pad) footprint dimensions table 6. sma flat (non exposed pad) dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.95 0.088 0.116 e 4.80 5.60 0.189 0.220 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 l1 0.50 0.019 l2 0.50 0.019 d a l 2x l l2 2x l1 2x e e1 b c 1.20 (0.047) 1.20 (0.047) 3.12 (0.123) 5.52 (0.217) 1.52 (0.060) millimeters (inches)
package information STPS2L30 8/10 figure 21. smb flat footprint (dimensions in mm) table 7. smb flat dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b (1) 1. applies to plated leads 1.95 2.20 0.077 0.087 c (1) 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.200 0.220 e1 4.05 4.60 0.189 0.181 l 0.75 1.50 0.029 0.059 l1 0.40 0.016 l2 0.60 0.024 d a l l l1 l2 e e1 b c 1.20 1.20 3.44 5.84 2.07
STPS2L30 ordering information 9/10 3 ordering information 4 revision history table 8. ordering information order code marking package weight base qty delivery mode STPS2L30a g30 sma 0.068 g 5000 tape and reel STPS2L30uf fg30 smb flat 0.050 g 5000 tape and reel STPS2L30af f30 sma flat 0.035 g 10000 tape and reel table 9. document revision history date revision changes jul-2003 3a last update. aug-2004 4 sma package dimensions update. reference a1 max. changed from 2.70mm (0.106 inc.) to 2.03mm (0.080). 31-jan-2007 5 reformatted to current standard. added ecopack statement. added smb flat package. 23-apr-2008 6 reformatted to current standards. added sma flat package.
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